Aolittel Technology Co.,Ltd

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1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

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Model Number :CQ06LT
Certification :UL,CUL
MOQ :1 Reel
Price :Negotiable
Payment Terms :T/T, Western Union
Supply Ability :4KKPCS Per Month
Delivery Time :2 Weeks
Packaging Details :Tape in reel,4kpcs per Reel
Type :SMD Fuse
Size :1.6x0.8mm 0603
Voltage :32V
Speed :Time-Lag
Current range :1-8A
Material :Ceramic
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View Product Description

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equipment

Application: Small Motor System, Portable Electronics Device, Input Power Port, Test Equipment

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

Features

a. High voltage and high current rating
b. High inrush and high breaking capacity
c. Fast arcing extinguished
d. Lead free & Halogen free material
e. Good explosion proof
f. Precise fusing time and cut-off completed
g. Suitable for rated current of 1A ~8A

h.Approval UL Recognized 1A~8A

i. Interrupting Rating 60 amperes at 32V DC

j. Soldering method :*Reflow Soldering : 260°C, 30Sec. max.*Wave Soldering : 260°C, 10Sec. max. *Hand Soldering : 350°C, 3Sec. max.

Environmental Specification

Operating Temperature -55°C to +125°C

Vibration MIL-STD-202G, Method 201(10-55 Hz, 0.06 inch, total excursion)

Salt Spray MIL-STD-202G, Method 101, Test Condition B (48Hrs)

Insulation Resistance MIL-STD-202G, Method 302, Test Condition A

Resistance to Solder Heat MIL-STD-202G, Method 210, Test Condition B (10sec, at 260°C)

Thermal Shock MIL-STD-202G, Method 107, Test Condition B (-65°C to +125°C)

Size

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

Specification

Product Type
Printing

(A)

(V)
cold resistance maximum voltage drop I²T value Breaking capacity Weight(single product)
CQ06LT 001 H 1A 32V 0.225 0 0.13
60 amperes at 32V DC
0.0027
CQ06LT 002 N 2A 32V 0.052 0 0.4
60 amperes at 32V DC
0.0027
CQ06LT 003 P 3A 32V 0.026 0 1.17
60 amperes at 32V DC
0.0027
CQ06LT 004 S 4A 32V 0.015 0 2.21
60 amperes at 32V DC
0.0027
CQ06LT 005 T 5A 32V 0.01 0 2.5
60 amperes at 32V DC
0.0027
CQ06LT 006 U 6A 32V 0.007 0 5.04
60 amperes at 32V DC
0.0027
CQ06LT 007 V 7A 32V 0.006 0 5.212
60 amperes at 32V DC
0.0027
CQ06LT 008 W 8A 32V 0.005 0 7.68
60 amperes at 32V DC
0.0027
CQ06LT 1.50 K 1.5A 32V 0.085 0 0.293
60 amperes at 32V DC
0.0027
CQ06LT 2.50 O 2.5A 32V 0.04 0 0.625
60 amperes at 32V DC
0.0027
CQ06LT 3.50 R 3.5A 32V 0.022 0 1.838
60 amperes at 32V DC
0.0027

1.Measured at ≦ 10% of rated current and 25°C.

2.Melting I2 t at 1000% of current rating.

Electrical Characteristic

Rated current 1 In 2 In 3 In 10 In
MIN MIN MAX. MAX max
1A~8A 4hr 1 SEC 120 SEC 3 SEC 0.05 sec

Physical Specification

Material

Construction Body Material: Ceramic

Termination Material: Silver(Ag),Nickel(Ni),Tin(Sn)

Fuse Element: Silver(Ag)

Packaging

1. Tape & Reel : 8mm tape

2. Packaging Specification : EIA Standard 481-D

3.Quantity : 4,000 pcs per reel.

China 1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi for sale

1.6x0.8 mm 0603 Ceramic Chip Package High Inrush Time-Lag Surface Mount Device SMD Fuse CQ06LT 32V 1-8 Amp For Test Equi

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